NANOFAB 100 platform: Plasma processing cluster

This cluster contains:

 

• PE module - plasma etching module
• PC module - plasma cleaning module
• RDC module - UHV radial distribution module
• LS module - Module for sample loading and storage
• RT module - UHV module for sample revolution and transportation

The plasma techniques cluster is used to perform cleaning, etching and deposition procedures. In particular it provides:
- express sub-micron etching of dielectrics (SiO₂, Si3N₄)
- etching of metals, including ion etching of gold, copper and other metals that produce no volatile composition
- etching of monocrystal silicon in various types of processes
- etching of arsenides and nitrides of gallium
- etching of polyimide, removal of resist
- deposition of dielectrics with high quality and uniformity (SiO₂, Si₃N₄)
- treatment in hydrogen plasma and atomic hydrogen

• Cluster overall dimensions - 320х320 cm.

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